SDSU PhD Student Andria Lemus Receives IMAPS Steve Adamson Student Recognition Award
In October 2025, SDSU PhD student Andria Lemus received the Steve Adamson Student Recognition Award from the International Microelectronics Assembly and Packaging Society (IMAPS), an international professional organization dedicated to advancing microelectronics packaging technologies. Significant technical research and/or service contributions to IMAPS and the microelectronics industry are considered during the judges' review for this award, which honors an active student member's participation in IMAPS events, chapters, and programs.
Andria is studying in the Joint Doctoral Program in collaboration with UCSD. She became involved with IMAPS after working in Dr. Arif Ege Engin’s laboratory as a graduate student mentor during the 2023 MESA Summer Undergraduate Research Academy. Under Dr. Engin’s guidance, the research team submitted its work to the IMAPS 2023 Symposium in San Diego, where IMAPS supports student participation by offering complimentary memberships and student exhibit booths.
During the symposium, Andria and fellow SDSU classmates presented their research at a student booth, engaging with industry professionals and researchers from around the world. The group returned to present their work again at the 2025 IMAPS Symposium. Through continued involvement with IMAPS, Andria has participated in Lunch & Learn events, professional development courses, and technical talks, gaining exposure to career pathways and emerging opportunities within the microelectronics and packaging field.
In an effort to expand student access to the organization, Andria and her peers recently submitted paperwork to establish an official IMAPS Recognized Student Organization chapter at SDSU. The chapter aims to educate students about the global microelectronics and packaging industry while providing networking opportunities with industry professionals. The student leadership board is currently collaborating with the San Diego professional IMAPS chapter to host technical seminars each semester.
Reflecting on her experience, Andria shared, “I feel very honored and grateful to be recognized by IMAPS. I would like to thank the people I have learned from through IMAPS. In particular, I am grateful to Dr. Beth Keser, Past President, for teaching courses on advanced packaging informed by her industry expertise, including leadership roles in Fan-Out and Fan-In Wafer Level Packaging Technology Development and New Product Introduction at Intel, prior experience at Qualcomm and Motorola, and her current position as Vice President of Packaging at Volantis Semiconductor. I also thank Mr. Bill Ishii, IMAPS San Diego Chair and IEEE IMS STEM Co-Chair at Sumitomo Electric USA Advanced Thermal Solutions Group, for supporting the student chapter and STEM initiatives for community college students, as well as Mr. Schieman, Executive Director, for supporting the student booth.”
“I hope that, by establishing the SDSU IMAPS chapter, more students can consider the career paths and graduate school opportunities that exist in this field,” Andria added.
